The Printed Circuit Assembler's Guide to: Process Validation
di Graham Naisbitt, Gen3
Questo è il prezzo che vedono i tuoi clienti. Modifica prezzi
Informazioni sul libro
Given the current trends toward smart infrastructures, industrial internet of things (IIoT), and connected and electric vehicles, electronic circuit boards are deployed into humid and potentially corrosive environments arguably to a greater extent than ever before; hence, they are at greater risk of failures due to electrochemical migration (ECM). Written by Graham Naisbitt of Gen3, this book explores how establishing acceptable electrochemical reliability can be achieved by using both CAF and SIR testing. This is a must-read for those in the industry who are concerned about ECM and want to adopt a better and more rigorous approach to ensuring electrochemical reliability.
Funzionalità e dettagli
- Categoria principale: Riferimento
-
Formato del progetto: 15×23 cm
N° di pagine: 60 -
Isbn
- Copertina morbida: 9781734200539
- Data di pubblicazione: gen 14, 2020
- Lingua English
Mostra di più
Informazioni sull'autore
IPC Publishing Group, Inc.
Bannockburn, IL
IPC Publishing Group, Inc. dba I-Connect007, is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.